Teledyne Relays' packaged SPDT Indium Phosphide Active RF Switches provide low insertion loss and high linearity, with bandwidths from DC​ up to 60GHz. These switches also maintain excellent signal integrity beyond 40Gbps, and have a very compact package size of 3mm x 3mm x 1mm. Teledyne​'s Active RF​​ switches are ideal for test and measurement systems, microwave communication, and radar applications. ​

​​​Part NO.​	Description​​​​​
​      ​​ In​P1​​012-​60​	​​Non-terminated SPDT Indium Phosphide Active RF Switch  • 3mm x 3mm x 1mm package size  • 100ns switching time • Monolithic solid-state switch with no mechanical wear • Flip-chip packaging provides shock & vibration resistance • ENEPIG surface finish for solder bonding • Low loss package with organic overmold • Test board with K-connectors​ can be provided​​ DC-60GHz​ 40+ Gbps
​       ​​ In​P1​​012-​40​	​Non-terminated SPDT Indium Phosphide Active RF Switch  • 3mm x 3mm x 1mm package size  • 100ns switching time • Monolithic solid-state switch with no mechanical wear • Flip-chip packaging provides shock & vibration resistance • ENEPIG surface finish for solder bonding • Low loss package with organic overmold • Test board with K-connectors​ can be provided​​ DC-40GHz​ 40Gbps
InP​1012-​3​0​  ​	​Non-terminated SPDT Indium Phosphide Active RF Switch  • 3mm x 3mm x 1mm package size  • 100ns switching time • Monolithic solid-state switch with no mechanical wear • Flip-chip packaging provides shock & vibration resistance • ENEPIG surface finish for solder bonding • Low loss package with organic overmold • Test board with K-connectors can be provided​​ ​ DC-30GHz
​           ​​​​​InP​1012-20​​​	​​​​​Non-terminated SPDT Indium Phosphide Active RF Switch  • 3mm x 3mm x 1mm package size  • 100ns switching time • Monolithic solid-state switch with no mechanical wear • Flip-chip packaging provides shock & vibration resistance • ENEPIG surface finish for solder bonding • Low loss package with organic overmold • Test board with K-connectors can be provided​​ DC-20GHz
​ ​    InP​1012-14​	​Non-terminated SPDT Indium Phosphide Active RF Switch  • 3mm x 3mm x 1mm package​ size  • 100ns switching time • Monolithic solid-state switch with no mechanical wear • Flip-chip packaging provides shock & vibration resistance​ • ENEPIG surface finish for solder bonding • Low loss package with organic overmold • Test board with K-connectors can be provided​​ DC-14GHz

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